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GP1A51HRJ00F
GP1A51HRJ00F
Gap : 3mm, Slit : 0.5mm *OPIC Output Case package Transmissive Photointerrupter
Description
GP1A51HRJ00F is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector in a case, providing non-contact sensing. For this family of devices, the emitter and detector are inserted in a case, resulting in a through-hole design. The case includes additional screw fixing holes, on both sides 3.2mm diameter.
Agency approvals/Compliance
1. Compliant with RoHS directive
Applications
1. General purpose detection of object presence or motion. 2. Example : Printer, FAX, Optical storage unit
Features
1. Transmissive with OPIC output 2. Highlights: * Verical Slit for alternate motion detection * Output Low Level at intercepting optical path * Includes additional screw fixing holes 3. Key Parameters: * Gap Width : 3mm * Slit Width (detector side) : 0.5mm * Package : 12.2x10x18mm 4. Lead free and RoHS directive compliant
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
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Sheet No.: D3-A03601EN Date Oct. 3. 2005 (c) SHARP Corporation
GP1A51HRJ00F
Internal Connection Diagram
Top view Voltage regulator
3 2
(15k)
4
1 2 3 4 5
Anode Cathode VCC VO GND
Amp
5 1
Outline Dimensions
Top view 12.20.3 2 3+0.2 -0.1
(Unit : mm)
5 2-3.20.2 7 6 10
0.5 3.5
(Detctor center) 2.5
A-A section
B-B section 1.5
A B Model No.
1A51HR
0.5
5-0.45+0.3 -0.1
9MIN.
A B
Date code
(1.5) 2-(1.27) 12 18
5 4 3
(9.2)
1
2
* Unspecified tolerance shall be as follows ;
Dimensions (d) d6 6Tolerance 0.1 0.2
* ( ) : Reference dimensions
Product mass : approx. 0.65g Dip soldering material : Sn-3Ag-0.5Cu
7.5
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Date code (2 digit)
1st digit Year of production A.D. Mark 2000 0 2001 1 2002 2 2003 3 2004 4 2005 5 2006 6 2007 7 2008 8 2009 9 2010 0 : : 2nd digit Month of production Month Mark 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 X 11 Y 12 Z
repeats in a 10 year cycle
Country of origin
Japan, Indonesia or Philippines (Indicated on the packing case)
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Absolute Maximum Ratings
Parameter 1 Forward current 1, 2 Peak forward current Input Reverse voltage Power dissipation Supply voltage Output current Output Power dissipation Operating temperature Storage temperature 3 Soldering temperature

Symbol Rating IF 50 IFM 1 VR 6 P 75 VCC -0.5 to +17 IO 50 250 PO Topr -25 to +85 Tstg -40 to +100 Tsol 260
(Ta=25C) Unit mA A V mW V mA mW C C C
1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2, 3 2 Pulse width 100s, Duty ratio=0.01 3 For 5s or less
Electro-optical Characteristics
Input Parameter Symbol Forward voltage VF Reverse current IR Operating supply voltage VCC Low level output voltage VOL High level output voltage VOH Low level supply current ICCL High level supply current ICCH 4 "LowHigh" threshold input current IFLH 5 Hysteresis IFHL/IFLH 6 "LowHigh" Propagation delay time tPLH "HighLow" Propagation delay time tPHL Rise time tr Fall time tf Responce time Condition IF=5mA VR=3V - VCC=5V, IOL=16mA, IF=0 VCC=5V, IF=5mA VCC=5V, IF=0 VCC=5V, IF=5mA VCC=5V VCC=5V VCC=5V, IF=5mA, RL=280 MIN. - - 4.5 - 4.9 - - - 0.55 - - - - TYP. 1.1 - - 0.15 - 1.7 0.7 1 0.75 3 5 0.1 0.05 MAX. 1.4 10 17 0.4 - 3.8 2.2 5 0.95 9 15 0.5 0.5
Output
Transfer characteristics
(Ta=25C) Unit V A V V V mA mA mA -
s

4 IFLH represents forward current when output goes from "Low" to "High". 5 IFHL represents forward current when output goes from "High" to "Low". 6 Test circuit for response time is shown in Fig.12.
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Fig.1 Forward Current vs. Ambient Temperature
60 50 Forward current IF (mA) 40 30
Fig.2 Output Power Dissipation vs. Ambient Temperature
300 250 200 150 100 50 0 -25
20 10 0 -25
0 25 50 75 85 Ambient temperature Ta (C)
100
Output power dissipation PO (mW)
0
25
50
75 85
100
Ambient temperature Ta (C)
Fig.3 Low Level Output Current vs. Ambient Temperature
60
Fig.4 Forward Current vs. Forward Voltage
Ta=75C Low level output current IOL (mA) 50 40 30 20 10 0 -20 1 0 25 50 75 85 100 0 0.5 1 1.5 2 Forward current IF (mA) 100 50C
25C 0C -25C
10
2.5
3
3.5
Ambient temperature Ta (C)
Foward voltage VF (V)
Fig.5 Relative Threshold Input Current vs. Supply Voltage
1.1 Relative threshold input current IFHL,IFLH Ta=25C IFLH=1 at VCC=5V
Fig.6 Relative Threshold Input Current vs. Ambient Temperature
1.8 Relative threshold input current IFHL,IFLH 1.6 1.4 1.2 IFHL 1 0.8 0.6 0.4 -25 VCC=5V IFLH=1 at Ta=25C IFLH
1 0.9 0.8
IFLH
IFHL 0.7 0.6 0.5 0 5 10 15 20 25 Supply voltage VCC (V)
0
25
50
75
100
Ambient temperature Ta (C)
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Fig.7 Low Level Output Voltage vs. Low Level Output Current
1
Fig.8 Low Level Output Voltage vs. Ambient Temperature
0.6 VCC=5V 0.5
VCC=5V Ta=25C Low level output voltage VOL (V)
Low level output voltage VOL (V)
0.4 0.3 0.2 0.1 IOL=30mA
0.1
16mA
5mA
0.01 1 10 100 0 -25 0 25 50 75 100
Low level output current IOL (mA)
Ambient temperature Ta (C)
Fig.9 Supply Current vs. Ambient Temperature
3 2.5 Supply current ICC (mA) 2 1.5 1 VCC=17V 0.5 0 -25 ICCH 10V 0 25 50 75 5V 100 VCC=17V 10V 5V ICCL
Fig.10 Propagation Delay Time vs. Forward Current
12 Propagation delay time tPLH, tPHL (s) 10 8 6 4 tPLH 2 0 0 10 20 30 40 50 60 VCC=5V RL=280 Ta=25C tPHL
Ambient temperature Ta (C)
Forward current IF (mA)
Fig.11 Rise Time,Fall Time vs. Load Resistance
0.8 0.7 Rise time, fall time tr, tf (s) 0.6 0.5 0.4 0.3 tr Ta=25C VCC=5V IF=5mA
Fig.12 Test Circuit for Response Time
IF=5mA Input (15k) tr=tf=0.01s ZO=50 47 Voltage regulator +5V 280 Output 0.01F Amp. GND Input
0.2 0.1 0 0.1 1 Load resistance RL (k) 10 tf Output tr tPLH
50% tPHL 10% tf V 90% OH 1.5V VOL
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Design Considerations Recommended operating conditions
Parameter Output current Forward current Operating terperature Symbol IO IF Topr MIN. - 10 0 TYP. - - - MAX. 16 20 70 Unit mA mA C
Notes about static electricity
Transisiter of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handing these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics.
Design guide
1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01F between VCC and GND near the device. 3) Position of opaque board Opaque board shall be installed at place 4mm or more from the top of elements. (Example)
4mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Parts
This product is assembled using the below parts.
* Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]
Category Photodiode Maximum Sensitivity wavelength (nm) 900 Sensitivity wavelength (nm) 400 to 1 200 Response time (s) 3
* Photo emitter (qty. : 1)
Category Infrared emitting diode (non-coherent) Material Gallium arsenide (GaAs) Maximum light emitting wavelength (nm) 950 I/O Frequency (MHz) 0.3
* Material
Case Black NORYL resin Lead frame plating Solder dip. (Sn-3Ag-0.5Cu)
* Others
Laser generator is not used.
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Manufacturing Guidelines Soldering Method Flow Soldering:
Soldering should be completed below 260C and within 5 s. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by reflow.
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350C. Please solder within one time. Please don't touch the terminals directly by soldering iron. Soldered product shall treat at normal temperature.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions.
Flux
Some flux, which is used in soldering, may crack the package due to synergistic effect of alcohol in flux and the rise in temperature by heat in soldering. Therefore, in using flux, please make sure that it does not have any influence on appearance and reliability of the photointerrupter.
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Cleaning instructions Solvent cleaning :
Solvent temperature should be 45C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Package specification Case package Package materials
Anti-static plastic bag : Polyethtylene Moltopren : Urethane Partition : Corrugated fiberboard Packing case : Corrugated fiberboard
Package method
100 pcs of products shall be packaged in a plastic bag, Ends shall be fixed by stoppers. The bottom ot the packing case is covered with moltopren, and the partition is set in the packing case. Each partition should have 1 plastic bag. The 10 plastic bags containing a product are put in the packing case. Moltopren should be located after all product are settled (1 packing contains 1 000 pcs).
Packing composition
Moltopren
Partition
Anti-static plastic bag
Packing case
Sheet No.: D3-A03601EN
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GP1A51HRJ00F
Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
[H161]
Sheet No.: D3-A03601EN
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